Laser Manufacturing

Munufacture Technology

Semiconductor Chip Beam Shaping Technology

Because of the special structure of the semiconductor laser, the fast and slow-axis beam quality are not the same, and the difference is large.The method of beam splitting rearrangement is used for beam shaping, that is, splitting the slow-axis beam first, then rotating the rearrangement to reduce the size of the spot in the slow-axis direction, increasing the size of the spot in the fast-axis direction, so as to achieve the uniformity of the product of the fast and slow-axis light parameters.Our company mainly uses lens groups to shape light beams through optical design.

Outer Cavity Semiconductor Wavelength Locking Technology

Our company mainly uses VBG, PDH and other technologies to lock the laser wavelength.

Multi-die Semiconductor Fiber Coupling Technology

High-power and high-brightness fiber-coupled semiconductor lasers based on multi-single-tube chips are ideal for achieving high beam quality and high brightness requirements.This is mainly due to the high beam quality, good heat dissipation, stable performance and easy Large-scale integration and other advantages, can be efficiently coupled to a small core diameter multimode fiber to obtain high-brightness laser output.